Deutsches Institut für Normung e. V.

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 91/951/CD:2010)

Project begin
2010-11-03

Planned document number
DIN EN 61249-4-19

Abstract
This standard gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-40 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates.

Responsible Committee
DKE/K 682 Montageverfahren für elektronische Baugruppen

Draft standard

DIN EN 61249-4-19 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 91/951/CD:2010)
Publication date : 2010-12

Order from Beuth Verlag

Version	Download	Shipment
Original language : de,en	Download EUR 77,40	Shipment EUR 78,90

Add to Shopping Basket