Deutsches Institut für Normung e. V.

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 47D/802/CD:2011)

Project begin
2011-07-07

Planned document number
DIN EN 60191-6-22

Abstract
This part of DIN EN 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

Responsible Committee
DKE/UK 631.4 Gehäuse für Halbleiterbauelemente

Draft standard

DIN EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 47D/802/CD:2011)
Publication date : 2011-08

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